About us
The cleanrooms offer a full range of routine fabrication capabilities including:
- Mask-based photolithography (chips to 6” wafers)
- Thermal and e-beam evaporation of metals
- Dielectric deposition by PECVD and ALD
- Dry etching of dielectrics, compound semiconductor materials and silicon
- Metrology, inspection and testing
- Cleaving, Sawing and die packaging
